APECS – European pilot line for advanced packaging and heterogeneous integration
APECS – European pilot line for advanced packaging and heterogeneous integration

Publications

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Papers

  • Bressler, Patrick R.; Töpper, Michael; Ram, Peter (2025): Europe’s pilot line for advanced packaging and heterogeneous integration of electronic components and systems (APECS). In: Nature Reviews Electrical Engineering. DOI: 10.1038/s44287-024-00134-6. Link: https://www.nature.com/articles/s44287-024-00134-6
  • Jung, Erik; Töpper, Michael; Mensing, Michael; Roscher, Frank; Hefer, Jan; Mai, Andreas; Becker, Karl Friedrich (2025): Advanced Heterogeneous System Integration of Chiplets and Quasi-Monolithic Integration. In: Special session on European Chiplet Innovation at MST Kongress 2025. Download PDF
  • Jordan, Rafael; Herzer, Elmar; Mensing, Michael; Möhrle, Martin; Schröder, Henning; Dietz, Marco; Töpper, Michael (2025): Advanced Packaging solutions for HPC, Communication and sensor modules enabled by APECS pilot line. In: Special session on European Chiplet Innovation at MST Kongress 2025. Download PDF
  • Guttowski, Stephan; Töpper, Michael; Grimm, Andreas (2025): Vision of the APECS Pilot Line. In: Special session on European Chiplet Innovation at MST Kongress 2025. Download PDF
  • Kriesten, Daniel; Pöllmann, Norbert; Wecker, Julia; Schröder, Dominik; Brand, Sebastian; Benndorf, Christopher; Strieter, Emanuele; Kabakci, Nisha Jakob; Kurth, Steffen; Altmann, Frank (2025): Characterization, testing & reliability for heterogeneous integration of chiplets. In: Special session on European Chiplet Innovation at MST Kongress 2025. Download PDF
  • Prautsch, Benjamin; Herzer, Elmar; Mensing, Michael; Künzel, Petra; Dietz, Marco; Lüdecke, André; Boerma, Hendrik; Hopsch, Fabian (2025): System-Technology-Co-Optimisation: The Heterogeneous Design Methodology in the APECS Pilot Line. In: Special session on European Chiplet Innovation at MST Kongress 2025. Download PDF
  • De la Fuente, Luis; Beatriz, Aja; Villa, Enrique; Artal, Eduardo; Neininger, Philipp; Friesecke, Christian; Thome, Fabian; Lujambio, Aintzane; Lobato, David; Rueda, Mario; Brückner, Peter; Cuadrado-Calle, David; Dutto, Valerie (2025): Robust Ku-Band Low-Noise Amplifier in GaN HEMT Technology. DOI: 10.23919/EuMC65286.2025.11235293. Link: https://ieeexplore.ieee.org/document/11235293
  • Riedmann, Nico;  Ćwikliński, Maciej; Schwantuschke, Dirk; Brückner, Peter (2025): A Compact GaN-Based D-Band High-Power Waveguide Amplifier Module. DOI: 10.23919/EuMC65286.2025.11235092. Link: https://ieeexplore.ieee.org/document/11235092
  • Zieciak, Thomas; Neininger, Philipp; Friesicke, Christian; Brückner, Peter; Quay, Rüdiger (2025): A 200 mW, High-Gain Gan-Based D-Band Power Amplifier for 6G Communication Applications. DOI: 10.23919/EuMIC65284.2025.11234457. Link: https://ieeexplore.ieee.org/document/11234457
  • Mugisho, Moïse Safari; Friesicke, Christian; Wagner, Sandrine; Quay, Rüdiger (2025): A V-Band (61-72 GHz) GaN HEMT High-Power Amplifier. DOI: 10.23919/EuMIC65284.2025.11234498. Link: https://ieeexplore.ieee.org/document/11234498
  • Zieciak, Thomas; Neininger, Philipp; Friesicke, Christian; Brückner, Peter; Quay, Rüdiger (2025): A D-Band Front-End T/R MMIC in a 70-nm GaN HEMT Technology. DOI: 10.1109/IMS40360.2025.11103926. Link: https://ieeexplore.ieee.org/document/11103926

Posters

  • Jordan, Rafael; Herzer, Elmar; Mensing, Michael; Möhrle, Martin; Schröder, Henning; Dietz, Marco; Töpper, Michael (2025): The Demonstrators of the APECS Pilot Line. In: Special session on European Chiplet Innovation at MST Kongress 2025. 
    Download Poster (PDF 1.03 MB)
  • Mai, Andreas; Yacoub, Hady (2025): Heterogeneous integration and QMI in APECS. In: FMD STCO Workshop at Semicon 2025. 
    Download Poster (PDF 0,58 MB)
  • Schiffer, Michael; Guttowski, Stephan (2025): Pilot Line for Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems (APECS): STCO for 2.5 & 3D Integration. In: FMD STCO Workshop at Semicon 2025.
    Download Poster (PDF 0,75 MB)
  • Kurth, Steffen; Altmann, Frank (2025): Characterization, test, reliability and security analysis for advanced heterogeneous integrated systems (CTR). In: FMD STCO Workshop at Semicon 2025.
    Download Poster (PDF 0,8 MB)
  • Jordan, Rafael; Herzer, Elmar; Mensing, Michael; Möhrle, Martin; Schröder, Henning; Dietz, Marco; Töpper, Michael (2025): The Demonstrators of the APECS Pilot Line (STCO). In: FMD STCO Workshop at Semicon 2025. 
    Download Poster (PDF 1,03 MB)
  • Prautsch, Benjamin; Just, Jana (2025): System Technology Co-Optimisation (STCO). In: FMD STCO Workshop at Semicon 2025. 
    Download Poster (PDF 0,36 MB)

Presentations

  • Luis Fonseca Chácharo (IMB-CNM-CSIC): "Presentación de línea piloto APECS" | December 4, 2025 | CHIPNATION 2025, Las Palmas de Gran Canaria, Spain
  • Rolf Aschenbrenner ( Fraumhofer IZM): "The APECS pilot line is powering the evolution of chiplet technologies" | November 19, 2025, 08:30 am | Advanced Packaging Conference at SEMICON. Munich, Germany
  • Dr. George Konstantinidis (IESL-FORTH): "APECS in the context of GaN MMICs" | November 6, 2025 | Micro Nano & Chips Tech 2025, Chania, Crete, Greece
  • Dr. Stephan Guttowski, Dr. Michael Töpper, Dr. Andreas Grimm, Prof. Albert Heuberger (Research Fab Microelectronics Germany): "Vision Of The APECS Pilot Line" | October 29, 2025 at 01:20 pm | MST Kongress 2025, Duisburg, Germany
  • Rafael Jordan (Research Fab Microelectronics Germany), Fabian Hopsch ( Fraunhofer IIS), Dr. Michael Mensing (Fraunhofer ISIT), Dirk Wünsch (Fraumhofer ENAS), Dr. Henning Schröder (Fraunhofer IZM), Marco Dietz (Fraunhoder EMFT), Dr. Michael Töpper (Research Fab Microelectronics Germany), Elmar Herzer (Fraunhofer IIS): "Advanced Packaging Solutions for HPC, Communication And Sensor Modules Enabled By APECS Pilot Line" | October 29, 2025 at 02:40 pm | MST Kongress 2025, Duisburg, Germany
  • Frank Altmann (Fraunhofer IMWS), Steffen Kurth (Fraunhofer ENAS): "Characterization, Testing & Reliability For Heterogeneous Integration Of Chiplets" | October 29, 2025 at 02:20 pm | MST Kongress 2025, Duisburg, Germany
  • Dr. Benjamin Prautsch, Elmar Herzer (Fraunhofer IIS), Dr. Michael Mensing (Fraunhofer ISIT), Dr. Petra Künzel (Fraunhofer ENAS), Marco Dietz (Fraunhofer EMFT), Andre Lüdecke (Fraunhofer IMS), Hendrik Boerma (Fraunhofer HHI), Fabian Hopsch (Fraunhofer IIS): "System-Technology-Co-Optimization: The Heterogeneous Design Methodology for the APECS Pilot Line" | October 29, 2025 at 02:00 pm | MST Kongress 2025, Duisburg, Germany
  • Dr. Michael Töpper (Research Fab Microelectronics Germany), Erik Jung (Fraunhofer IZM): "Advanced Heterogeneous System Integration of Chiplets and Quasi-Monolithic Integration" | October 29, 2025 at 01:40 pm | MST Kongress 2025, Duisburg, Germany
  • Dr. Patrick Bressler, Dr. Stephan Guttowski (Research Fab Microelectronics Germany): "Presentation of APECS Pilot Line - Peak Performance in Heterogeneous Integration" | October 1, 2025 at 09:30 am | IMAPS 2025, San Diego, USA
  • Dr. Wenke Weinreich (Fraunhofer IPMS): "European Pilot Line APECS – Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems" | May 19, 2025 | IEEE MEDTS 2025, Albany, NY, USA
  • Rolf Aschenbrenner ( Fraumhofer IZM): "The APECS pilot line is powering the evolution of chiplet technologies" | May 14, 2025 | ISSE 2025,  Budapest, Hungary
  • Jörg Amelung (Fraunhofer IPMS): "APECS Research Pilot Line for advanced heterointegration innovation in the MEMS industry" | April 16, 2025 | M.S.W.S. USA 2025, Silicon Valley, USA

Papers

  • Zahra Safari Jafarlou, Martin Moehrle, Ariane Sigmund, Konstantin Wenzel, Robert B. Kohlhaas (all Fraunhofer HHI), Martin Schell (Fraunhofer HHI and Technical University Berlin) (2026): Ultra-stable 50GHz high peak power colliding-pulse mode-locked lasers with spot size converter. In: Optics Express Vol. 34, No. 4 / 23 Feb 2026. DOI: 10.1364/OE.562301. Link: https://doi.org/10.1364/OE.562301
  • M. Theurer, G. Vasudevan Rajeswari, J. Andree, C. Kottke (all Fraunhofer HHI), R. Freund (Fraunhofer HHI and Technical University Berlin), P. Runge (Fraunhofer HHI), M. Moehrle (Fraunhofer HHI), A. Sigmund (Fraunhofer HHI), and M. Schell (Fraunhofer HHI and Technical University Berlin) (2026): High-Bandwidth-Density Uncooled EML Array for up to 770 Gb/s/mm and 11 km Fiber Reach. In: Optical Fiber Conference OFC 2026, 07.-11. March, 2026, Los Angeles, USA, paper TU3J.3.

 

Presentations

  • Christian Herpers (Fraunhofer EMFT): "Picosecond Pulse Generation Methods for Die-to-Die ESD Testing" | July 13-16, 2026 | IPFA 2026, Marina Bay Sands, Singapore
  • Dr. Konstanze Scheurer (Research Fab Microelectronics Germany): "APECS Pilot Line: Your Gateway to Heterogeneous Integration & Packaging Technologies" | June 17/18, 2026 | EPoSS Annual Forum 2026, Braga, Portugal
  • Prof. Dr. Ulrike Ganesh (Fraunhofer IZM): "Bridging the Gap: Collaborative Industry - Research Ecosystems in Advanced Packaging" | April 21, 2026 at 9:20 am | Advanced Packaging International Conference, Brussels, Belgium
  • Dr. Fabian Luis Vargas (IHP - Leibniz Institute for High Performance Microelectronics): "IHP technologies and APECS pilot line" | March 24, 2026 | EEE Space Component Sovereignty for Europe Workshop, Nordwijk, The Netherlands
  • Dr. Benjamin Prautsch (Fraunhofer IIS): Unlock the Chiplet Technology Now! – Chiplet Development and Applications from a European Perspective | March 11, 2026 | Embedded World 2026, Nuremberg, Germany
  • Rolf Aschenbrenner (Fraunhofer IZM): "EUROPEAN CHIPS ACT" | February 24, 2026 | 13. GMM/DVS-Fachtagung, EBL 2026, Fellbach, Germany
  • Christine Kallmayer (Fraunhofer IZM): "The APECS pilot line – evolution of an european RTO ecosystem for heterogenous integration" | February 20, 2026 at 02.45 pm | IEEE HIR 2026 Symposium, San Jose, USA
  • Dr. Stephan Guttowski (Research Fab Microelectronics Germany): "The APECS Pilot Line: Peak Performance in Heterogeneous Integration" | January 5, 2026 at 12:00-1:00pm | IMPAS & ACerS San Diegeo - Lunch & Learn, San Diego State University, USA
 

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