Publications

Thome, Fabian; Brückner, Peter; Quay, Rüdiger (2024): A >120-GHz Bandwidth, >20-dBm Pout, <6-dB Noise-Figure Distributed Amplifier MMIC in a GaN-on-SiC HEMT Technology. In: IEEE transactions on microwave theory and techniques. DOI: 10.1109/TMTT.2024.3385713. Link: https://ieeexplore.ieee.org/document/10507180

• Jordan, Rafael; Herzer, Elmar; Mensing, Michael; Möhrle, Martin; Schröder, Henning; Dietz, Marco; Töpper, Michael (2025): The Demonstrators of the APECS Pilot Line. In: Special session on European Chiplet Innovation at MST Kongress 2025. 
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• Mai, Andreas; Yacoub, Hady (2025): Heterogeneous integration and QMI in APECS. In: FMD STCO Workshop at Semicon 2025. 
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• Schiffer, Michael; Guttowski, Stephan (2025): Pilot Line for Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems (APECS): STCO for 2.5 & 3D Integration. In: FMD STCO Workshop at Semicon 2025.
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• Kurth, Steffen; Altmann, Frank (2025): Characterization, test, reliability and security analysis for advanced heterogeneous integrated systems (CTR). In: FMD STCO Workshop at Semicon 2025.
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• Jordan, Rafael; Herzer, Elmar; Mensing, Michael; Möhrle, Martin; Schröder, Henning; Dietz, Marco; Töpper, Michael (2025): The Demonstrators of the APECS Pilot Line (STCO). In: FMD STCO Workshop at Semicon 2025. 
  Download Poster (PDF 1,03 MB)

• Prautsch, Benjamin; Just, Jana (2025): System Technology Co-Optimisation (STCO). In: FMD STCO Workshop at Semicon 2025. 
  Download Poster (PDF 0,36 MB)

• Bressler, Patrick R.; Töpper, Michael; Ram, Peter (2025): Europe’s pilot line for advanced packaging and heterogeneous integration of electronic components and systems (APECS). In: Nature Reviews Electrical Engineering. DOI: 10.1038/s44287-024-00134-6. Link: https://www.nature.com/articles/s44287-024-00134-6

• Jung, Erik; Töpper, Michael; Mensing, Michael; Roscher, Frank; Hefer, Jan; Mai, Andreas; Becker, Karl Friedrich (2025): Advanced Heterogeneous System Integration of Chiplets and Quasi-Monolithic Integration. In: Special session on European Chiplet Innovation at MST Kongress 2025.

• Jordan, Rafael; Herzer, Elmar; Mensing, Michael; Möhrle, Martin; Schröder, Henning; Dietz, Marco; Töpper, Michael (2025): Advanced Packaging solutions for HPC, Communication and sensor modules enabled by APECS pilot line. In: Special session on European Chiplet Innovation at MST Kongress 2025.

• Guttowski, Stephan; Töpper, Michael; Grimm, Andreas (2025): Vision of the APECS Pilot Line. In: Special session on European Chiplet Innovation at MST Kongress 2025.

• Kriesten, Daniel; Pöllmann, Norbert; Wecker, Julia; Schröder, Dominik; Brand, Sebastian; Benndorf, Christopher; Strieter, Emanuele; Kabakci, Nisha Jakob; Kurth, Steffen; Altmann, Frank (2025): Characterization, testing & reliability for heterogeneous integration of chiplets. In: Special session on European Chiplet Innovation at MST Kongress 2025.

• Prautsch, Benjamin; Herzer, Elmar; Mensing, Michael; Künzel, Petra; Dietz, Marco; Lüdecke, André; Boerma, Hendrik; Hopsch, Fabian (2025): System-Technology-Co-Optimisation: The Heterogeneous Design Methodology in the APECS Pilot Line. In: Special session on European Chiplet Innovation at MST Kongress 2025.