Powering AI/ML with high-performance chiplets, scalable architectures, and cutting-edge design methodologies.
Main topics:
The holistic system design as access to an efficient and robust design environment for fully integrated systems as well as the fundamental ability to create system designs in the new technologies.
Development and provision of technological process chains for component and chiplet integration using advanced packaging technologies to implement a chiplet-based system concept.
Characterization, Test & Reliability (CTR), in which new concepts for quality assurance, safety and yield improvement are developed and provided.
APECS supports the objectives of the European Green Deal by promoting sustainable technologies, minimizing energy consumption, reducing environmental impact, and enhancing resource efficiency. Through initiatives such as systemic eco-design and green manufacturing, APECS contributes to Europe's transition to a carbon-neutral and circular economy.
Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems