APECS capabilities for advanced packaging and heterogeneous integration
The APECS pilot includes components, technologies and services for RF-, opto-, photonics-, HPC and sensor applications in the area of heterogeneous integration and advanced packaging. Our goal is to provide a full process chain from design to packaging including characterization, test and reliability processes.
Four demonstrators to show and proof a gapless process chain are part of the APECS project. The demonstrators were chosen to address all current and foreseeable challenges in microelectronics.
APECS – European pilot line for advanced packaging and heterogeneous integration