The APECS pilot includes components, technologies and services for RF-, opto-, photonics-, HPC and sensor applications in the area of heterogeneous integration and advanced packaging. Our goal is to provide a full process chain from design to packaging including characterization, test and reliability processes.
Four demonstrators to show and proof a gapless process chain are part of the APECS project. The demonstrators were chosen to address all current and foreseeable challenges in microelectronics.
Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems