Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems
Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems

Chiplets and components

RF chiplets and integration

© FBH

Target

  • Integration of RF devices to enable mm-wave to sub-THz transceivers and sensors in a scalable approach
  • Assembly and interconnect processes suitable for extremely high signal frequencies, enabling the advent of THz electronics
  • QMI (Quasi-monolithic integration) chiplet platform for SiGe/CMOS and  BiCMOS technologies

Innovations

  • InP heterobipolar (InP HBT) chiplets with (Bi)CMOS: InP-on-BiCMOS
  • BiCMOS chiplets with CMOS
  • H-band InGaAs-on-Si HEMT and D-band GaN-on-SiC HEMT chiplets

Impact

  • Seamless design and fabrication process
  • MMIC chiplet platform for various applications: 6G, optical communications, and radar/sensing

Photonic chiplets and integration

© Fraunhofer Mikroelektronik

Target

  • Novel back-end-of-line interface technologies for photonic
    chips based on InP and GaAs
  • InP-based high speed EML transmitter chiplets for
    optical interconnects
  • GaAs-based laser/SOA chiplets for integration
    with passive PIC platforms, for applications in sensing, quantum and bio-photonics

Innovations

  • Ultra-high speed InP EML chiplets as arrays allowing for, e.g., 800 Gbps data transmission
  • Integrated electrical and optical interfaces between EML chiplet, driver chiplet, interposer chip and optical fiber connections

Impact

  • Heterogeneous integration platform of InP EML and InP driver chiplets, offering complete Tx components
  • Quasi-monolithic integration with additional components (waveguides, resonators, …)

QMI systems

© Fraunhofer IPMS - Jörg Amelung

Target

  • QMI describes the combination of chiplets with different functionalities using a BEOL-like interconnect system enabling fine pitch and high-density integration

Innovations

  • QMI for CMOS compatible optical sensor chiplets
  • QMI of MEMS and NEMS chiplets to CMOS wafers, and integration of 3D-MEMS devices for IoT nodes
  • QMI for advanced microelectronic chiplets on
    300 mm

Impact

  • Highly integrated SOC for AI applications (Sensor AI)
  • Ultra Low power electronic systems (for system core / memory SoCs)
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