Events

The scientific programme will highlight the latest advances in materials research at an international level, with a strong emphasis on interdisciplinary research in both fundamental and applied areas.

1st Flanders Semiconductor Forum A new annual meeting point for the Flemish and European semiconductor ecosystem Bringing together Europe's semiconductor initiatives and the Flemish ecosystem

South Asia's leading trade fair for electronics development and production.

The 2026 edition marks a significant expansion, with 400+ exhibiting companies from over 20 countries, showcasing cutting-edge technologies, innovations, and solutions across the entire microelectronics ecosystem.

The 59th International Symposium on Microelectronics is organized by the International Microelectronics Assembly and Packaging Society and held in Boston, Massachusetts. IMAPS Symposium offers one of the most robust programs for microelectronics and advanced packaging technical content. Each year, we welcome many repeat attendees as well as hundreds of first-time visitors – early career packaging professionals, those new to the industry, and students.

FIRST by FMD is a European conference on semiconductor trends, technology roadmaps and strategic alignment in microelectronics. Decision-makers from industry, policy and research discuss the future of Europe’s semiconductor ecosystem in the context of the EU Chips Act. The program provides insights into emerging technologies such as advanced packaging, chiplet architectures and heterogeneous integration, as well as industrial roadmaps of the European semiconductor industry.

The European Microwave Week (www.eumweek.com) offers a broad coverage of the microwave area. This annual event is the premier microwave event in Europe and brings together the microwave community from around the world. The Week is organized around three conferences: the European Microwave Conference (EuMC), the European Microwave Integrated Circuits Conference (EuMIC) and the European Radar Conference (EuRAD). Beside the Conference there is also the European Microwave Exhibition, which is the largest microwave and RF trade show in Europe. Guidelines have been issued by EuMA to ensure a smooth organization and management of the event. They are at the disposal of the officers in charge of any part of the EuMW.

Experience the latest technologies ranging from surface mounting technology (SMT) and through-hole technology (THT) through to advanced packaging and 3D MID. EFX will enable you to obtain information about current trends and innovations, and also forge valuable contacts.

16th International Conference on Advanced Semiconductor Devices and Microsystems

The 5th APECS Roadshow makes its next stop in Austria during EBSCON Week 2026 in Graz and Klagenfurt in Southern Austria. Meet the APECS team and learn how Europes Advanced Packaging and Heterogeneous Integration Pilot Line supports innovation from research to industrial deployment. The roadshow provides an opportunity for companies, start-ups, researchers and ecosystem partners to explore access opportunities, collaboration models and available technology platforms within APECS.