APECS – European pilot line for advanced packaging and heterogeneous integration
6th APECS Roadshow at CHIPNATION
Event details
Program
December 9 between 12:00-1:00 p.m.:
APECS will chair the session “From System Requirements to Chiplet-Based Systems: Advanced Packaging and Heterogeneous Integration”. Session includes presentations from Daniel Caudevilla Gutiérrez (Indra Group), Joaquín Ceballos (IMSE-CNM) and Miguel Ullán (IMB-CNM) and Karl-Friedrich Becker (Fraunhofer IZM). Moderated by Teresa Orellana Pérez (FMD)
December 10 between 12:00-1:30 p.m:
Participation in session “Pilot Lines EU”. Christoph Kroh (FMD) will give a 15-minute pitch.
Registration
Contact
Location
Barcelona, Spain
Date
December 09, 2026 - December 11, 2026