APECS – European pilot line for advanced packaging and heterogeneous integration
7th APECS Roadshow at Emerging Tech Forum
Event details
Program
December 16 at 2:00 p.m.:
Participation in workshop with Hellenic Chips Competence Centre (HCCC) on how to access European Pilot Lines. Cécile Mohr (FMD) will give a presentation on “Making Advanced Packaging and Heterogeneous Integration accessible: from innovation to implementation with APECS”
December 17:
Presentation “Why Advanced Packaging and Heterogeneous Integration Matters for Europe’s Semiconductor Future” (Cécile Mohr)
Registration
Contact
Location
Athens, Greece
Date
December 16, 2026 - December 17, 2026