APECS – European pilot line for advanced packaging and heterogeneous integrationPathway to high-performance, low-power chips
As part of the APECS pilot line’s broader access strategy, the annual Open Access Calls invite players across the semiconductor value chain to submit project ideas for selected pilot line technologies. The calls provide structured, guided, and transparent access to APECS’ modern R&D infrastructure, enabling companies, RTOs and universities to validate concepts, accelerate development, and collaborate directly with APECS experts.