Integration & Packaging Technologies

Overview

Within APECS, we develop the Chiplet Integration Platform for 2.5D and 3D integration, enabling functional, scalable, and high‑performance chiplet-based systems across RF, photonic, MEMS and heterogeneous applications. We advance functional interposers in silicon, glass, ceramic and organic technologies, targeting ultra‑high-density redistribution layers, TSV/TGV structures, integrated passive devices, and added functionalities such as optical waveguides, thermal management and stress‑control layers. We establish functional integration methods including side‑by‑side and stacked architectures on 200/300 mm wafers and develop advanced packaging approaches such as micro‑transfer printing, volumetric integration and high‑reliability assembly.

We offer advanced interconnection and integration technologies including balling on organic substrates with solder preforms, wafer-level balling with solder preforms, wafer-level bumping, and micromagnets integrated in glass. Our solutions enable highly reliable electrical connections, precise assembly processes, and novel functional integration for next-generation electronic and microsystem applications. By combining scalable manufacturing approaches with innovative material integration, we help partners achieve robust performance, increased design flexibility, and accelerated time-to-market.

Name	Description	Tools	Technical Details
Balling on organic substrates with solder preforms	Back-end service to provide solderable UBM with solder bumps: High density I/O BGA configurations Applicable to wafers and singulated dies Repair services	Wagenbrett WB300 PacTech SB²-Jet	Available alloys: SAC, SnBi, Cu-core, etc. 80 µm - 500 µm solderball diameters Solder ball jetting with intregrated reflow Single ball pick-and-place into flux or solder paste Stencil based ball drop
Balling on wafer level with solder preforms	See above	See above	See above
Wafer Level Bumping	Semi-Additive Electroplating Materials available: Cu, Sn, SnAg, Ni, Au, AuSn, nanoporous Au, In, InSn Material-specific Flip-Chip Assembly is available	UBM Sputtering Spin-on Resist Coating (thin/thick resists) Mask Aligner /Laser Direct Imager Electroplating of Cu, Sn, SnAg, Ni, Au, … Wet Etching / Ion Mill	Typical Interconnect Dimensions (min / typ / max): -Diameter: <5µm / 20…40µm / >50µm -Pitch: <5…20µm / 25…100µm / >100µm -Height: <5µm / 10…30µm / 30…130µm -Dimensions depend on used metal scheme and assembly type -Other dimensions on request
Micromagnets integrated in glass	With a femtosecond laser the glass is locally exposed, so that the glass becomes etchable (LIDE Process). The process allows the fabrication of cavities with vertical side walls. In a second process, a magnetic powder is filled in these cavities and solidified in an ALD process	Fs-Laser (LPKF, LIDE Process) (QNC-ISiT-03) KOH wet bench (QNC-ISiT-03) ALD tool for batch processes	Lateral dimensions: from 50 µm up to mm size Laser feature size: from 15 µm to mm size Depth: up to 450 µm Depth accuracy: +- 10 µm Glasses: fused silica, BF33, AF32 Wafer size: 200 mm