Multi Project Wafer Runs

Overview

© Fraunhofer IMS
Multiproject wafer with different sensor ASICs on

Our Multi-Project Wafer (MPW) services provide flexible, cost-efficient access to advanced photonic and semiconductor technologies, enabling rapid prototyping and reliable fabrication for research, development, and pre-production applications. By sharing wafer space across multiple customers, we significantly reduce development costs while maintaining high-quality processing standards and predictable turnaround times.

From high-performance TFLN platforms for advanced modulation, to fully integrated InP transmitter and receiver solutions, and high-frequency SiGe:C BiCMOS technologies, our MPW offerings support scalable innovation across photonics and mixed-signal applications.

Name	Description	Tools	Technical Details
TFLN MPW Foundry Service	Dedicated designs and wafer runs MPW tape out every 3 months 3 months fabrication time	Full TFLN processing line	TFLN platform with high-speed phase modulator, MMI and directional coupler, ring resonator, fiber to waveguide spot size converter, thermo-optical phase shifter and on-chip termination resistor
InP MPW Foundry Service	Generic Integration Technology AND InP Foundry Platform / MPW Service 4 MPW runs per year 5 month fabrication time	Full InP processing line	InP Transmitter/Receiver platform with passives, MMIs, AWGs, SOAs, DFB lasers, DBR gratings, MZMs, EAMs, electro-optic phase shifters, 40G pin detectors, spot size converter and thermo-optic phase shifters
SiGe:C BiCMOS technologies	MPW Service with 0.13 and 0.25 μm SiGe BiCMOS technologies on 8” silicon wafers	8” pilot line	SG13S: fT/fmax = 250/330 GHz, 3.3 V I/O CMOS, 1.2 V logic CMOS SG13G2 / SG13G2Cu: enhanced bipolar performance up to 350/450 GHz SG13G3Cu: highest bipolar performance up to 470/650 GHz