Advanced Packaging and Heterogeneous Integration for Electronic Components and SystemsAPECS is actively lowering the threshold for access to heterogenous integration for SMEs and start-ups. Here’s what we offer:
Chiplet integration with die-to-wafer hybrid bonding.
- Open tech access: APECS offers fair, transparent access to its pilot line for EU foundries, SMEs, and start-ups, ensuring inclusivity and non-discrimination per the Chips Act.
- Start-ups without cleanrooms: APECS supports SMEs/start-ups by guiding them to the best process lines and optimizing project execution for their proof-of-concept needs.
- Collaboration-driven growth: APECS fosters partnerships across the chiplet ecosystem, enabling innovation, standardization, and new business opportunities for all players.
- Design and deliver custom chiplet-based systems from concept to characterization.
- Develop chiplet-related IP to enhance customer technology and competitiveness.
- Test new chiplet processes within customer-specific fabrication workflows (Lab-to-Fab).
- Perform machine and material testing using pilot line fabrication equipment for reliability and performance.
- Apply advanced heterogeneous integration on customer-specified materials for tailored microelectronics solutions.
APECS offers start-ups flexible entry and exit points, supporting everything from individual innovations to full workstreams in advanced heterogeneous system integration.
By enabling European SMEs to engage across the emerging chiplet and advanced packaging value chain, APECS creates new market opportunities and strengthens Europe’s competitiveness in next-generation electronics.