Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems
Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems

Access for semiconductor customers

© Fraunhofer ISIT
© Fraunhofer ISIT
  • Easy access to specialized technologies for high complexity products: By strategically linking advanced and leading-edge semiconductor technology pilot line facilities, as well as design and system integration technologies, it will be possible to demonstrate and validate new innovations supporting the digital revolution.
  • Use of advanced heterogeneous system integration for creating new products and business offerings: Offering the semiconductor ecosystem with domestic prototypic options, APECS is central for taking breakthrough ideas from exploratory research and laboratory proof-of-concept to industrial products.
  • Proof of concept, demonstrators with high TRL / low volume production: APECS bridges the gap between theoretical innovation and practical application, paving the way for next-level integration technologies.
  • Scaling up into commercial technologies in line with market growth: APECS is redefining the boundaries of what is possible in semiconductor technology, driving innovation, and enhancing performance across various applications.
  • Access to in-house chip design and APECS capabilities, as well as support for the provision and operation of design platforms
  • Bolstering the European supply chain for semiconductor manufacturing: We create links between RTOs, manufacturers, material and equipment suppliers, design houses, Startups, SMEs and foundries.

APECS provides the complete value chain from (test & analysis) strategies to training with the flexible option of ENTRY/EXIT and with the promise that we will realize the projects with our customers in the shortest possible time, with the best quality and with qualified employees.

Europe’s share across the entire semiconductor value chain - from design to manufacturing capacity - has shrunk and the EU currently relies on chips made in Asia. While Europe has market share and plays a role in equipment, EDA, materials and IP, the situation in semiconductor assembly and test is quite different; we are dependent on outsourced activity mostly in Asia, such as South Korea, China, Malaysia, Japan or Taiwan. 

This is even more critical in the back end of line of semiconductor production especially for electronic packaging. Due to the ever-increasing requirements for size and efficiency, the role of advanced packaging has become increasingly important. The paradigm shift towards chiplet integration and advanced packaging technologies represents a significant and vital change in the semiconductor industry, with the escalating demands for dense, more efficient, powerful, and versatile electronic systems. Advanced packaging will integrate CMOS and non-CMOS devices like RF, optoelectronics, sensors, and MEMS, and is reshaping the landscape of electronic device manufacturing and functionality, contributing significantly to the growth of the electronics industry.

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