Advanced Packaging and Heterogeneous Integration for Electronic Components and SystemsAPECS is the “one-stop-shop” for researchers in the field of semiconductor manufacturing and chiplet innovation. Here’s what we offer:
- Access to advanced tech services: APECS pilot line offers small-volume prototyping, strategic collaboration, contract research, and joint projects.
- Bridging lab to industry: APECS helps scale semiconductor innovations to industrial production, overcoming the "Valley of Death" in tech transfer.
- Training and skills growth: APECS boosts the advanced packaging community by developing key competences and inspiring interest in high-tech fields.
APECS brings together top research institutes, including Fraunhofer, Leibniz, and leading international partners, to advance innovation in advanced packaging and heterogeneous system integration. By leveraging FMD’s extensive cleanroom facilities, wafer capabilities, and diverse technology platforms—from optoelectronics to MEMS—this consortium fosters seamless collaboration, strengthens Germany’s position in microelectronics, and accelerates transformative developments that benefit both research and industry. Together, APECS expands technological capabilities, enhances quality, and drives the next generation of electronic systems.