Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems
Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems

Access

Low volume production – high value chips. The APECS pilot line gives you access to key technologies and institutions.

At APECS, we offer open-access technologies to the entire chip industry including chip foundries, IDMs, customers, academia, and start-ups. Our pilot line covers the full value chain, from design to advanced packaging, testing, and characterization, enabling faster innovation and easy tech transfer. With state-of-the-art equipment, expertise, and scalable processes, we support Europe’s semiconductor ecosystem and next-gen electronics. Whether developing chiplets, sensors, or complex systems, APECS helps bringing innovations to market efficiently and reliably.

Our capabilities include:

  • Surface technologies
  • Advanced packaging and assembly technologies
  • Chiplet and chip development
  • Sensors
  • Design offers
  • Characterization, test and reliability
  • Measurement technologies
  • Failure analysis
  • Hardware security
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© Fraunhofer ISIT

For chip foundries

  • Predevelopment of technology modules
  • Access to design services to create foundry business
  • Outsourcing handling of prototype runs / small volume business
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© Fraunhofer ISIT

For IDMs

  • R&D services, focus on transferability into commercial production lines
  • Use of advanced heterogenous system integration for creating new products and business offerings
  • Options for insourcing of high innovative products with volume forecast
  • Design services for IDMs' new chips
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For semiconductor customers

 

  • Easy access to specialized technologies for high complexity products
  • Use of advanced heterogeneous system integration for creating new products and business offerings
  • Proof of concept, demonstrators with high TRL / low volume production
  • Scaling up into commercial technologies in line with market growth
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© Maksim Shmeljov | Adobe Stock

For the research community

 

  • Access to extended technology capabilities in research cooperation
  • Support of transfer of research results into applications
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© Blue Planet Studio | Adobe Stock

For start-ups

 

  • Access to special technology
  • Prospect to create technology start-up without own cleanroom
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Coming soon: Open calls

Dedicated open call on specific services and technologies

APECS open calls invite all players in the semiconductor industry—including chip foundries, IDMs, customers, SMEs, start-ups, and academia—to submit project requests for collaboration on our pilot line technologies.

Taking place once a year from 2026 to 2029, these calls promote specific advanced technologies and offer selected participants hands-on access to our equipment, expertise, and full value chain.

Projects from SMEs, start-ups, and academic partners will be given preferential consideration, helping accelerate innovation and strengthen Europe’s semiconductor ecosystem.

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  • APECS open calls (yearly 2026–2029) invite the semiconductor industry to propose projects ideas or customer’s needs on specific pilot line technologies, offering access to equipment, expertise, and the full value chain. SMEs, start-ups, and academia receive priority access to foster innovation and strengthen Europe’s semiconductor ecosystem.

  • At APECS, we provide open-access technological capabilities to the entire chip industry—including chip foundries, IDMs, semiconductor customers, academia, and start-ups. Our pilot line supports the full value chain, from design and development to advanced packaging, testing, and characterization, enabling faster innovation and seamless technology transfer.

  • Potential customers can submit their inquiries via our contact form or directly to one of the technology experts from the FMD office and the institutes. An expert team will evaluate the inquiry and choose the right technological group/partner. After an initial call, project proposals can directly discussed with the designated partner.

  • The offers of the APECS pilot line are designated to all EU member states and countries that are part of the Horizon Europe program. Besides that, companies from other countries can apply based on certain criteria.

  • The APECS pilot line provides easy and open access to cutting edge technologies in the field of advanced packaging and heterogeneous integration. It delivers an easy possibility to reach technological goals for the whole semiconductor industry.

Added value for cooperation with APECS:

  • Cooperation with FMD as the major RTO on the critical area of heterogeneous integration in EU
  • Increased outreach to EU and national research ecosystem
  • Opportunity to network with major industries in joint projects

Publications

Find out more about FMD publications on the subject of chiplet technologies on the FMD website.