Access for IDMs

Our services for IDMs in short:

© Fraunhofer ISIT
  • R&D services, focus on transferability into commercial production lines
  • Use of advanced heterogenous system integration for creating new products and business offerings
  • Options for insourcing of high innovative products with volume forecast
  • Design services for IDMs' new chips

Our R&D services for Industrial Device Manufacturing (IDM) transform research into scalable, market-ready solutions, bridging the gap between innovation, production, and quality assurance.

Leveraging advanced heterogeneous system integration and cutting-edge materials such as glass and organic interposers, we enable high-efficiency chiplet integration for CMOS, III-V, optical, and broadband electronics.

From custom chip design and characterization to process optimization and insourcing of innovative products, we help companies bring new technologies to market efficiently, sustainably, and cost-effectively.

With deep industry expertise, we provide end-to-end support that accelerates product launch, enhances performance, and gives your business a lasting competitive advantage.

First open access call starts April 1st

Submit your project idea and get access to APECS technologies

APECS open calls invite all players in the semiconductor industry—including chip foundries, IDMs, customers, SMEs, start-ups, and academia—to submit project requests for collaboration on our pilot line technologies.

Taking place once a year from 2026 to 2029, these calls promote specific advanced technologies and offer selected participants hands-on access to our equipment, expertise, and full value chain.

Projects from SMEs, start-ups, and academic partners will be given preferential consideration, helping accelerate innovation and strengthen Europe’s semiconductor ecosystem.

 

To open access call