CTR platform

Services

Comprehensive characterization, test and reliability platform to support manufacturing
Provision of complete functional and reliability test capabilities and strategies along the whole value chain
Innovative and unique test system (photonics test head)
Test service (volume test)
Knowledge transfer (test hardware and methods)
Support by cutting-edge failure analysis capabilities for industrial technology ramp up, series production and market introduction
Support of continuous market success by field by counterfeit detection and identification of IP violations

Advanced characterization tools and methods for chiplets and QMI systems with large variety of signal types (DC, RF, high speed digital, mm-wave, optical)
High accurate and low-noise measurement capabilities for determination and evaluation of heterointegrated devices
Methods to characterize dielectric materials in sub-THz frequencies
Identification of technology weaknesses and validation of design and simulation models of chiplets, modules and systems

Reliable information about the performance of technologies and components at the development stage ensure
Short development cycles and direct feed back to STCO to optimize the design
Specification handbook for processes, chiplets, systems
Demonstrator functionality

Facilities for wafer-level and chip-level testing for optical, RF, and mm-wave signals, …80 Volt, … 18 GHz in the clean room
High accurate and low-noise measurement capabilities for determination and evaluation of heterointegrated devices
Testhead for wafer level and chip level optical and RF/mm-wave tests
Efficient methods for volume test to ensure statistically relevant feedback to technology development and for the pilot fabrication series

Test for MRAM-based chiplets, e.g. on interposers and of critical high-speed communication IP and chiplets before assembly
Burn-in test of chiplets
Electro-optical test (position, warp, scratches,..) and X-ray inspection as part of the fabrication pilot line
Test of systems for S-parameters up to 250 GHz under load-pull in D band (110 -170 GHz).

Provision of reliability testing and failure analysis capabilities for chiplets & HI
Understanding of technology and application related defect risks and identification of new failure modes and degradation mechanisms
Consideration of quality and reliability aspects during development -> improved design for reliability
Assurance of manufacturing quality and stable long-term behavior of chiplets & HI devices

Test methods to assess and mitigate discharging risks
Non-destructive 3D defect analysis and electrical fault isolation
Multi-domain reliability testing and failure analysis techniques
Advanced material characterization and FEM- and AI-based degradation and lifetime modeling
New concepts for Design for Reliability

Cutting-edge characterization and failure capabilities for defect analysis & quality control for:
Accelerating device development & qualification
Optimizing manufacturing yield
Improving reliability under harsh environments
Supporting faster market introduction

Implementation of architecture-level security measures and security IP blocks on chiplet, HI device up to system level
Establishing of strong framework to ensure hardware security along the manufacturing chain
Characterization and improvement of device and system resilience against physical attacks

Advanced techniques for security assessment of security relevant models in heterogeneous systems.
Test and analysis for authenticity check and counterfeit defense
Test and analysis for IP-protection
Test and analysis for legacy products for long-living systems