Advanced Packaging and Heterogeneous Integration for Electronic Components and SystemsEvent
Event details
Program
SEMICON Europa is the largest European electronics platform connecting industry leaders across the entire design and manufacturing supply chain. It is held annually, alternating with productronica and electronica, and is organized by SEMI Europe.
SEMICON Europa provides attendees with opportunities to exchange ideas and promote technological progress featuring the most advanced and innovative electronics manufacturing in Europe.
Several programs are offered to address the critical issues and challenges facing the microelectronics industries, such as the Executive Forum, Advanced Packaging Conference, Fab Management Forum and many networking events and conferences.
APECS Pilot Line is represented at Chips JU booth C2419.
Registration
Location
Trade Fair Center Messe München
Date
November 12, 2024 - November 15, 2024