Events  /  July 02, 2025  -  July 03, 2025

Component-to-System Level Packaging Workshop – Addressing Integration Challenges for Automotive and Industrial Applications

The workshop is intended to bring together industry experts presenting and discussing CLP and SLP trends, requirements, challenges, solutions and the needs for guidelines/ standards desired for design, assembly, test, reliability and manufacturing from components (OSAT) and electronic manufacturing solutions (EMS) perspective.