Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems
3rd APECS EU-Roadshow: Sweden
Event details
Program
Technical Session (as part of the NordPac program), evening reception with 2–3 keynote speakers and networking dinner, and a potential site visit VTT
Topic:
3D Integration, Waferlevel Packaging (WP5.4. collaboration with VTT)
Pilot Line Integration:
APECS (tbc)
Participants on the FMD side:
Experts from the field of advanced packaging + VTT
Participants on the Finnish side:
NordPac attendees, SMEs and startups from the SCCC network, and representatives from Swedish innovation hubs (e.g. Electrification Hub, Västerås)
Contact
Location
Stockholm (during NordPac Conference)
Date
June 09, 2026