Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems
3rd APECS EU-Roadshow: Sweden
Event details
Program
Evening Reception on June 8 with keynotes and networking dinner (in collaboration with SCCC), Technology Workshop on June 11 featuring expert speakers from FMD and VTT (as part of the NordPac program)
Topic:
Hardware integration of chiplet-based systems, Advanced Packaging, 300 mm interposer technologies, high-density substrates, advanced assembly approaches, LTCC (Low Temperature Co-fired Ceramic) technologies.
Pilot Line Integration:
APECS
Participants on the FMD side:
Rolf Aschenbrenner (Fraunhofer IZM), Felix Mohn (business office FMD), Kim Emmerich (business office FMD)
Participants on the Scandinavian side:
NordPac attendees, SMEs and startups, academia, representatives from SCCC and VTT
Contact
Location
Stockholm (during NordPac Conference)
Date
June 08, 2026 - June 11, 2026