Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems
2nd APECS EU-Roadshow: Finland
Event details
Program
Topic:
Technical Deep Dive into the European Pilot Lines
Pilot Line Integration:
APECS, FAMES, NanoIC, PIXEurope, and WBG
Participants on the FMD side:
Experts from the field of advanced packaging + VTT
Participants on the Finnish side:
RTOs and industrial companies from the Finnish and Baltic environment
Contact
Location
Espoo (VTT)
Date
March 23, 2026