Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems
1st APECS EU-Roadshow: Netherlands
Event details
Program
Topic:
Advanced Packaging in Photonics
Pilot Line Integration:
APECS and PIXEurope
Participants on the FMD side:
3-4 experts from the fields of packaging and photonics + G3C
Participants on the NL side:
Universities (e.g., TU Delft), SMEs, startups, possibly representatives from corporations such as NXP & Besi (tbc)
Contact
Location
Novio Tech Campus, Nijmegen
Date
December 10, 2025 - December 11, 2025