Workshop

Workshop on 3D / 2.5D System Integration

Uhrzeit	Programmpunkt
09:00 - 10:10	3D / 2.5D System Integration and Interposer Processes
10:10 - 10:30	Discussion & Break
10:30 - 11:40	Design for 3D / 2.5D Systems
11:40 - 12:00	Discussion & Break
12:00 - 13:00	Lunch Break
13:00 - 14:00	Technologies and Materials for 3D / 2.5D Integration: TSV, RDL, Fine-Pitch Bonding
14:00 - 14:20	Discussion & Break
14:20 - 15:20	3D Lithography and 3D Printing
15:20 - 15:40	Discussion & Break
15:40 - 16:40	3D MEMS Packaging
16:40 - 17:00	Discussion & End

Regulary: 200 €
Early Bird: 150 € until 8 weeks before the workshop

Fraunhofer-Institut für Photonische Mikrosysteme IPMS
Maria-Reiche-Str. 2
01109 Dresden

Telefon +49 351 8823-1515

Fraunhofer Institute for Integrated Circuits IIS – Division for Adaptive Systems Development EAS
Münchner Straße 16, 01187 Dresden

Date

November 25, 2025

English