APECS – European pilot line for advanced packaging and heterogeneous integration
5th APECS EU-Roadshow
Event details
Program
The 5th APECS Roadshow makes its next stop in Austria during EBSCON Week 2026 in Graz and Klagenfurt in Southern Austria.
Meet the APECS team and learn how Europes Advanced Packaging and Heterogeneous Integration Pilot Line supports innovation from research to industrial deployment. The roadshow provides an opportunity for companies, start-ups, researchers and ecosystem partners to explore access opportunities, collaboration models and available technology platforms within APECS.
Visit us at EBSCON 2026 on 7 October 2026 at Messecongress Nord, 8010 Graz
The APECS team will be present throughout EBSCON 2026 with an exhibition booth, offering insights into:
- Advanced Packaging technologies
- Heterogeneous Integration solutions
- Pilot Line access opportunities
- Collaboration and technology transfer pathways
- Open access services for industry, SMEs and start-ups
APECS at the Carinthia Applied Systems Day - Robotics @Klagenfurt on 8 October 2026 at Lakeside Science & Technology Park GmbH, 9020 Klagenfurt
APECS will contribute to the session: "From Research Excellence to Market Success"
During this session, the APECS team will highlight how Europe's pilot line infrastructure accelerates the industrial uptake of advanced semiconductor technologies and strengthens the European microelectronics ecosystem.
We look forward to meeting you in Southern Austria!
Contact
Dr. Christoph Kroh
Research Fab Microelectronics Germany (FMD)
E-Mail
Location
Graz and Klagenfurt, Austria
Date
October 07, 2026 - October 08, 2026