Events

Learn more about the APECS pilot line and meet our experts at the following trade fairs, conferences, and workshops.

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  • Fraunhofer Institute for Reliability and Microintegration IZM / November 06, 2025 - November 07, 2025

    Electronic Packaging Days 2025

    © Fraunhofer IZM

    The event is designed to facilitate direct exchange between IZM researchers and companies. The aim is to present current research work and technological developments in the field of microelectronic packaging and heterogeneous system integration and to discuss these with partners. During the coffee and lunch breaks, participants will be spoilt for choice – a total of 12 IZM laboratories and the clean room will open their doors for half-hour tours. At the same time, expert sessions will offer the opportunity to talk to IZM experts about the institute's technological services and learn more about the APECS pilot line.

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  • Messe München / November 18, 2025 - November 21, 2025

    SEMICON Europa 2025

    semicon europe logo

    SEMICON Europa 2025 is co-located with productronica in Munich, Germany creating the strongest single event for electronics manufacturing in Europe, and broadening the range of attendees across the electronics chain.

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  • Messe München / November 19, 2025, 09:00 am - 01:00 pm

    STCO Workshop

    © Messe München GmbH

    Unlocking potential: the role of the APECS pilot line in system technology co-optimization for European microelectronics.

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  • Fraunhofer Institute for Integrated Circuits IIS – Division for Adaptive Systems Development EAS / November 25, 2025

    Workshop on 3D / 2.5D System Integration

    © Volker Mai / Fraunhofer IZM

    Gain in-depth insights into 3D and 2.5D integration approaches, advanced miniaturization technologies, and innovative methods for developing powerful, compact electronic systems.

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