Events

Brazil takes center stage as the partner country of HANNOVER MESSE 2026, positioning itself as a key driver of sustainable industrial transformation. As Latin America’s largest economy, rich in natural resources and supported by a rapidly expanding industrial base, Brazil stands among the world’s most influential economic powers. HANNOVER MESSE provides the perfect platform to connect Brazil’s innovative strength with Germany’s technological excellence, foster meaningful partnerships, and unlock new opportunities across global markets.

The 1st Advanced Packaging International builds on the momentum driving the next era of semiconductor innovation.

The 2026 MRS Spring Meeting & Exhibit will convene materials researchers from academia, industry, government and national laboratories together for a week of cross-disciplinary collaboration and scientific exchange. Set against the backdrop of one of MRS’s most inspiring locations, the Meeting & Exhibit will feature breakthroughs in areas such as sustainable manufacturing, advanced characterization and energy materials—driving forward innovation on a global scale.

Innovation in Failure Analysis and Material Diagnostics of Electronics Components. As usual, the CAM-Workshop will bring together experts from the electronics industry and material diagnostics equipment manufacturers. The goal is to discuss challenges, innovative solutions, and future requirements in the field of failure analysis and material characterization of electronic devices, sensors, and systems. In addition to the scheduled oral presentations, there will be an industrial exhibition featuring suppliers of failure analysis and material diagnostics equipment. This unique concept allows for direct interaction between electronics failure analysis experts and diagnostics equipment manufacturers. It has helped establish the CAM workshop as an internationally recognized event and a hub for failure diagnostics in electronics.

Organized within the framework of the PIXEurope Pilot Line – coordinated by ICFO and co-funded by the Chips Joint Undertaking and participating Member States, with support from regional authorities – this event will be the first to bring together end-users, technology providers, industry leaders and policymakers around this Pan-European initiative.

The conference will consist of 24 parallel symposia with invited speakers, oral and poster presentations assorted by a plenary session to provide an international forum for discussing recent advances in the field of materials science. The meeting will be augmented by an exhibition of products and services of interest to the conference participants. The latest scientific results will be presented and authors are invited to submit papers in the selected journals that fit the scope of each symposium. The focus of the scientific program will be both on fundamental investigations and technological applications, providing an international forum for discussing recent advances related to the different aspects to be considered to promote innovation.

The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.

3D Integration, Waferlevel Packaging (WP5.4. collaboration with VTT).

The PCIM Expo & Conference is the leading international event for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. It connects experts from industry and academia who are dedicated to driving forward products, research and development along the entire value chain. This has made the PCIM Expo & Conference an indispensable meeting place for the industry and the home of power electronics for decades.

The event brings together both academics, as well as industry leaders, to discuss and debate state-of-the-art and future trends in microelectronics, packaging, integration, reliability testing, PCB design, assembly and manufacturing of electronics, optics, electronics in health tech, materials, Artificial Intelligence (AI), and Internet of Things (IoT) in electronics. This is the 62nd event organised by IMAPS Nordic chapter.