Events

The Czech Investment Forum 2026: Semiconductors for Future Mobility is organised as part of the broader initiative Czech Semicon Days, dedicated to the development of the semiconductor sector and its strategic role within the European economy. This week‑long platform brings together key stakeholders from the semiconductor industry, related industrial sectors, public authorities and research institutions.

Innovation in Failure Analysis and Material Diagnostics of Electronics Components. As usual, the CAM-Workshop will bring together experts from the electronics industry and material diagnostics equipment manufacturers. The goal is to discuss challenges, innovative solutions, and future requirements in the field of failure analysis and material characterization of electronic devices, sensors, and systems. In addition to the scheduled oral presentations, there will be an industrial exhibition featuring suppliers of failure analysis and material diagnostics equipment. This unique concept allows for direct interaction between electronics failure analysis experts and diagnostics equipment manufacturers. It has helped establish the CAM workshop as an internationally recognized event and a hub for failure diagnostics in electronics.

The race toward the next frontier in artificial intelligence is making daily headlines. But reaching next-gen AI isn't a sprint; it's a marathon. The rewards will be shared by humanity: applications that far exceed anyone's imagination, in domains such as healthcare, mobility, and robotics.

Organized within the framework of the PIXEurope Pilot Line – coordinated by ICFO and co-funded by the Chips Joint Undertaking and participating Member States, with support from regional authorities – this event will be the first to bring together end-users, technology providers, industry leaders and policymakers around this Pan-European initiative.

The conference will consist of 24 parallel symposia with invited speakers, oral and poster presentations assorted by a plenary session to provide an international forum for discussing recent advances in the field of materials science. The meeting will be augmented by an exhibition of products and services of interest to the conference participants. The latest scientific results will be presented and authors are invited to submit papers in the selected journals that fit the scope of each symposium. The focus of the scientific program will be both on fundamental investigations and technological applications, providing an international forum for discussing recent advances related to the different aspects to be considered to promote innovation.

The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.

Ireland’s semiconductor industry is a vital part of its high-tech economy, driven by strong government support, skilled talent, and global investment. Home to major players like Intel, Analog Devices, and Infineon, Ireland is a hub for advanced chip design, R&D, and manufacturing. The sector supports innovation across ICT, automotive, and medical technologies. Ongoing infrastructure development and academic-industry collaboration continue to strengthen Ireland’s position as a key contributor to the global semiconductor supply chain.

The Sensor Decade is an Oslo Science City Arena event. It is a place to share knowledge and experience, accelerating the growth of new ideas. Oslo Science City wants to help enable and improve innovation opportunities by creating an arena for leading researchers and highly motivated students to interact with dynamic business incubators and disruptive companies.

This session will present APECS activities and expertise in the integration of advanced electronic systems, with a focus on enabling technologies for next-generation sensing applications. It will highlight how APECS supports faster innovation cycles and facilitates access to cutting-edge infrastructure for industry, research and emerging players across Europe.

Join us on June 8, 2026, for an exclusive networking reception at the Kista Semiconductor Arena in Stockholm, hosted by the Swedish Chip Competence Center (SCCC) and the APECS Pilot Line. Taking place on the evening before the NordPac Conference, this informal gathering offers a relaxed setting to connect with peers across the Nordic semiconductor community and to engage with APECS representatives. The APECS Pilot Line, part of the EU Chips Act, is driving innovation in advanced packaging and heterogeneous integration, strengthening Europes capabilities in chiplet technologies.