Events

The conference will consist of 24 parallel symposia with invited speakers, oral and poster presentations assorted by a plenary session to provide an international forum for discussing recent advances in the field of materials science. The meeting will be augmented by an exhibition of products and services of interest to the conference participants. The latest scientific results will be presented and authors are invited to submit papers in the selected journals that fit the scope of each symposium. The focus of the scientific program will be both on fundamental investigations and technological applications, providing an international forum for discussing recent advances related to the different aspects to be considered to promote innovation.

The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.

The conference seeks papers on all aspects of BEOL/MOL interconnects and metallization, including design, unit process, integration and reliability, as well as how it applies to 2.5D/3D and heterogenous integration. Authors are encouraged to submit their original work describing innovative research and development in the critically important field of on-chip interconnects and heterogeneous integration.

This edition is a must-attend forum for CEOs shaping the future of advanced manufacturing and photonics. Designed for executive decision-makers, this summit brings together the leaders driving the shift from specialized photonic solutions to scalable, high-volume, and cost-efficient manufacturing. Through candid, roadmap-level discussions and in-person engagement across the full value chain, you’ll gain the insight needed to guide investment, form high-impact partnerships, and unlock new markets across AI, data communications, sensing, industrial, and health applications. This is where strategy meets execution—and where photonics becomes a competitive advantage at scale. The Optica Global Advanced Manufacturing Alliance annual meeting is where the future of scalable photonics takes shape.

The Sensor Decade is an Oslo Science City Arena event. It is a place to share knowledge and experience, accelerating the growth of new ideas. Oslo Science City wants to help enable and improve innovation opportunities by creating an arena for leading researchers and highly motivated students to interact with dynamic business incubators and disruptive companies.

The second annual SwissChips event will take place on Thursday, June 4th 2026 at the external page Swisstech Convention Center (Lausanne, EPFL). The event will once again bring together SwissChips researchers, universities of applied sciences and external collaborators, as well as industry leaders for a day of talks, posters, networking and discussion. Our vision is to create a strong platform through our annual event for Swiss research in semiconductor technologies, microelectronics, and cutting-edge integrated circuit (IC) design.

The event aims to connect Hungarian academic, industrial, and SME stakeholders with the European CCC network, creating opportunities for personal introductions, networking, and future international collaborations. During the event, Hungarian SMEs, industrial stakeholders, and the HCHiP consortium will present their profiles, ideas, and collaboration opportunities. European CCCs and partners will also have the chance to introduce themselves, showcase their expertise, and highlight the areas in which they are seeking partners through poster presentations.

This session will present APECS activities and expertise in the integration of advanced electronic systems, with a focus on enabling technologies for next-generation sensing applications. It will highlight how APECS supports faster innovation cycles and facilitates access to cutting-edge infrastructure for industry, research and emerging players across Europe.

Join us on June 8, 2026, for an exclusive networking reception at the Kista Semiconductor Arena in Stockholm, hosted by the Swedish Chip Competence Center (SCCC) and the APECS Pilot Line. Taking place on the evening before the NordPac Conference, this informal gathering offers a relaxed setting to connect with peers across the Nordic semiconductor community and to engage with APECS representatives. The APECS Pilot Line, part of the EU Chips Act, is driving innovation in advanced packaging and heterogeneous integration, strengthening Europes capabilities in chiplet technologies.

The PCIM Expo & Conference is the leading international event for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. It connects experts from industry and academia who are dedicated to driving forward products, research and development along the entire value chain. This has made the PCIM Expo & Conference an indispensable meeting place for the industry and the home of power electronics for decades.