Events

Heterogeneous Systems for the Intelligently Connected Era.

The workshop is intended to bring together industry experts presenting and discussing CLP and SLP trends, requirements, challenges, solutions and the needs for guidelines/ standards desired for design, assembly, test, reliability and manufacturing from components (OSAT) and electronic manufacturing solutions (EMS) perspective.

The 25th European Microelectronics & Packaging Conference. The European Microelectronics and Packaging Conference (EMPC 2025) is the premier international conference for microelectronics packaging, owned and sponsored by IMAPS-Europe and co-sponsored by IEEE-EPS. The conference program will focus on industrial needs and trends and on academic long-term solutions. The event brings together researchers, innovators, technologists, business and marketing managers with an interest in semiconductor packaging.

The 28th edition of the European Microwave Week (EuMW 2025) will come to Utrecht to continue the annual series of highly successful microwave events that started back in 1998.