Events

The 25th European Microelectronics & Packaging Conference. The European Microelectronics and Packaging Conference (EMPC 2025) is the premier international conference for microelectronics packaging, owned and sponsored by IMAPS-Europe and co-sponsored by IEEE-EPS. The conference program will focus on industrial needs and trends and on academic long-term solutions. The event brings together researchers, innovators, technologists, business and marketing managers with an interest in semiconductor packaging.

The 28th edition of the European Microwave Week (EuMW 2025) will come to Utrecht to continue the annual series of highly successful microwave events that started back in 1998.

The event is designed to facilitate direct exchange between IZM researchers and companies. The aim is to present current research work and technological developments in the field of microelectronic packaging and heterogeneous system integration and to discuss these with partners. During the coffee and lunch breaks, participants will be spoilt for choice – a total of 12 IZM laboratories and the clean room will open their doors for half-hour tours. At the same time, expert sessions will offer the opportunity to talk to IZM experts about the institute's technological services and learn more about the APECS pilot line.

SEMICON Europa 2025 is co-located with productronica in Munich, Germany creating the strongest single event for electronics manufacturing in Europe, and broadening the range of attendees across the electronics chain.