Events

Gain in-depth insights into 3D and 2.5D integration approaches, advanced miniaturization technologies, and innovative methods for developing powerful, compact electronic systems.

EFECS 2025 is the premier European Forum for Electronic Components and Systems, dedicated to advancing the sector’s growth and innovation. Taking place in Malta on December 3-4, 2025, this event brings together industry leaders, policymakers, researchers, and innovators to strengthen Europe’s strategic leadership in semiconductor technology. Join us at EFECS 2025 to connect with leaders and innovators shaping the future of electronics and semiconductor technologies in Europe!

Advanced Packaging in Photonics. 1-day workshop and 2 company visits

The event combines the brokerage activities of the industry associations AENEAS, EPoSS and INSIDE into one networking event dedicated to project proposals for the new Chips JU Calls 2026. This event gathers the ECS community around project ideas, allowing it to network, build consortia and start creating project proposals.

Bridging Skills & Innovation for India’s Industry

The 22nd Annual Device Packaging Conference (DPC 2025) will be held in Phoenix, Arizona, on March 2-5, 2026. It is an international event organized by the International Microelectronics Assembly and Packaging Society and a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields.

From 4 to 6 March 2026, representatives of microelectronics research at German universities and industry will come together in Bochum to discuss trends, opportunities and challenges in the promotion of young talent.

The Industry Strategy Symposium Europe brings together executives and high-level experts to offer microelectronics market forecasts, as well as insights into the latest economic and societal trends, geopolitics, and technologies shaped by the microelectronics industry.

Technical Deep Dive into the European Pilot Lines. Technical workshop (as part of the NordPac program), evening reception with 2–3 keynote speakers and networking dinner.

3D Integration, Waferlevel Packaging (WP5.4. collaboration with VTT).