Events

Technical Deep Dive into the European Pilot Lines. Technical workshop (as part of the NordPac program), evening reception with 2–3 keynote speakers and networking dinner.

The workshop will focus on presenting the current status of the EEE Initiative, exploring future activities, and fostering dialogue among key stakeholders, including EEE Component Manufacturers, associated supply chains, relevant testing facilities, end-users, academia, and ESA Member State delegations. Your participation is highly valued as we strive to build a robust and comprehensive programme for European EEE Components. In addition, dedicated EEE Initiative technology splinter workshops may be organised on 25 March 2026. Please note that a splinter UDSM workshop is already scheduled for this date.

The POEMS Semiconductor Spring School is an introductory week designed for advanced bachelor and early master students eager to explore the frontiers of microelectronics and semiconductors. Over five days, participants will dive into the main POEMS areas: Chip Design, Advanced Packaging, and Emerging Technologies. Through lectures, demonstrations, and talks by leading researchers and industry experts, students will gain insight into the state-of-the-art, current industrial challenges, and emerging international trends. With a dynamic, flexible format and interactive feedback sessions, the POEMS Semiconductor Spring School offers a unique opportunity to connect with peers, learn from experts, and discover the possibilities within the field.

Design, Automation and Test in Europe Conference | The European Event for Electronic System Design & Test

Weltleitmesse für die produzierende Industrie. Brasilien ist Partnerland der HANNOVER MESSE 2026 und präsentiert sich als Motor für eine nachhaltige industrielle Transformation. Als größte Volkswirtschaft Lateinamerikas mit reichen Rohstoffvorkommen und einer wachsenden Industrie zählt Brasilien zu den bedeutendsten Wirtschaftsnationen weltweit. Ideale Bedingungen, um auf der Messe brasilianische Innovationskraft und deutsche Technologiekompetenz zusammenzubringen, Netzwerke zu knüpfen und neue Märkte zu erschließen.

The 1st Advanced Packaging International builds on the momentum driving the next era of semiconductor innovation.

The 2026 MRS Spring Meeting & Exhibit will convene materials researchers from academia, industry, government and national laboratories together for a week of cross-disciplinary collaboration and scientific exchange. Set against the backdrop of one of MRS’s most inspiring locations, the Meeting & Exhibit will feature breakthroughs in areas such as sustainable manufacturing, advanced characterization and energy materials—driving forward innovation on a global scale.

Innovation in Failure Analysis and Material Diagnostics of Electronics Components. As usual, the CAM-Workshop will bring together experts from the electronics industry and material diagnostics equipment manufacturers. The goal is to discuss challenges, innovative solutions, and future requirements in the field of failure analysis and material characterization of electronic devices, sensors, and systems. In addition to the scheduled oral presentations, there will be an industrial exhibition featuring suppliers of failure analysis and material diagnostics equipment. This unique concept allows for direct interaction between electronics failure analysis experts and diagnostics equipment manufacturers. It has helped establish the CAM workshop as an internationally recognized event and a hub for failure diagnostics in electronics.

The conference will consist of 24 parallel symposia with invited speakers, oral and poster presentations assorted by a plenary session to provide an international forum for discussing recent advances in the field of materials science. The meeting will be augmented by an exhibition of products and services of interest to the conference participants. The latest scientific results will be presented and authors are invited to submit papers in the selected journals that fit the scope of each symposium. The focus of the scientific program will be both on fundamental investigations and technological applications, providing an international forum for discussing recent advances related to the different aspects to be considered to promote innovation.

The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.