APECS – European pilot line for advanced packaging and heterogeneous integration
The Ferdinand-Braun-Institut (FBH) is a center of excellence for microwave technology, photonics, and quantum physics, delivering high-performance III-V compound semiconductor components that drive breakthroughs in energy-efficient millimeter-wave electronics, precision photonics, and heterogeneous chiplet integration. The institute develops high-efficiency power amplifiers, millimeter-wave frontends, and advanced diode lasers that power next-generation mobile networks, space communications, and quantum systems. The institute works closely with industry and research partners, offering complete solutions and know-how – from design to ready-to-use modules and prototypes.
Within the APECS pilot line, FBH accelerates chiplet innovation by developing indium phosphide (InP) heterobipolar MMIC chiplets for SiGe-BiCMOS integration up to the D-band, alongside GaAs-based laser-diode chiplet platforms for photonic integrated circuits (PICs).