APECS – European pilot line for advanced packaging and heterogeneous integration
Leibniz IHP is a world-leading research center specializing in silicon-germanium (SiGe) technology, high-frequency circuits, and wireless communication systems. It delivers world-class silicon-germanium technologies and advanced heterogeneous integration methods that enable ultra-high-speed circuits, THz ASICs, and quasi-monolithic chiplet platforms for global communication systems. The institute holds global performance records in transistor speed and drives innovation in aerospace, telecommunications, and smart sensing.
Within the APECS pilot line, IHP makes use of its industrial 8-inch SiGe BiCMOS cleanroom to pioneer advanced heterogeneous integration methods, such as its signature Al-to-Al bonding for collective die bonding. IHP provides scalable, high-performance chiplet solutions necessary to anchor Europe’s semiconductor ecosystem by developing active interposers for indium phosphide (InP) integration and establishing quasi-monolithic integration (QMI) platforms.