APECS – European pilot line for advanced packaging and heterogeneous integrationThe first APECS roadshow took place in Nijmegen and Enschede, Netherlands, and brought the APECS pilot line into direct contact with the Dutch photonics and advanced packaging ecosystem. Over two days, representatives from research institutes, industry, politics as well as the Dutch Chips Competence Centre (ChipNL) shared knowledge and explored opportunities for collaboration. The agenda included technical presentations, laboratory visits, and stakeholder discussions, providing valuable insights into regional strengths and needs of the Dutch semiconductor ecosystem. The roadshow established new connections between German and Dutch innovation actors and laid the foundation for future cross-border cooperation.
