APECS – European pilot line for advanced packaging and heterogeneous integrationIn Stockholm, the APECS roadshow teamed up with the Swedish Chips Competence Centre (SCCC), organizing an informal networking event for stakeholders across the Nordic semiconductor ecosystem ahead of the NordPac Conference. The event demonstrated the value APECS and the SCCC can bring to the regional ecosystem by providing access to the pilot-line infrastructure, advanced packaging, test and qualification when technologies move closer to industrial deployment.
During NordPac, APECS, FMD, and VTT experts hosted a technical workshop, focusing on APECS’ chiplet integration platform, interposer portfolio as well as LTCC technologies. The roadshow helped align APECS capabilities with the priorities and needs of the Nordic semiconductor community and laid the foundation for future collaboration.
