APECS – European pilot line for advanced packaging and heterogeneous integrationThe second APECS roadshow in Helsinki, Finland, focused on strengthening collaboration between Europe’s semiconductor pilot lines and the Nordic innovation ecosystem. It was hosted by VTT and the Finnish Chips Competence Centre (FiCCC) and combined pilot line presentations, technical deep dives as well as a dedicated APECS workshop. Discussions centered mainly on STCO, advanced packaging and heterogeneous integration technologies, while also highlighting APECS access models and opportunities for future collaboration. Bringing together stakeholders from competence centres, academia, research organizations and industry, the roadshow provided a platform for knowledge exchange and reinforced connections across the Scandinavian and Baltic semiconductor landscape.
