Organic substrates and panel level packaging

Development and fabrication of multi-layer electronic interconnection architectures based on resin layers which typically include specific filler particles or glass cloths (organic substrates)
Cover a wide range of applications from ultra dense chip interposers to high power applications using adapted materials and process approaches
Large area panel level fabrication using advanced printed circuit board process technologies
Organic substrate processes as basis for heterogeneous integration of single or multiple electronic components into the substrates
Improvement of electronic functionality and reliability and size reduction of systems or packages at the same time

Fine line processing down to 2 µm line/space copper interconnects in multilayer circuit architectures with ABF/BU dielectric
Vertical interconnect with diameter down to 10 µm
Use of glass panels in the core of organic multilayers
Implementation of specific materials for applications in high frequency, power, and medical electronics respectively