Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems
Radio Frequency (RF) Chiplet
Target
In the area of complex, highly integrated RF systems, four different technology demonstrators will be used to show the performance and innovative power of the various combinations of semiconductor and heterogeneous integration technologies. The fields of application that can be addressed range from the latest generation of mobile radio applications and wireless links to radar applications. The focus is also on the practical testing of the design enablement developed in APECS (ADKs, tools, etc.) as well as metrological verification and series testing.
Innovation
The innovation here lies in innovative integration technologies such as the Flex Polymer Substrate, as well as in the combination of RF chiplets in various semiconductor technologies into a compact, high-performance and heterointegrated chip. This results first time in high performance millimeter-wave and sub-THz modules.
Partners
| FMD OFFICE | Overall support |
| FBH | InP-HBT chiplets, mounting them on BiCMOS |
| IHP | BiCMOS chiplets for InP-on-BiCMOS D-Band and InGaAs H-band TRX, BiCMOS technology adaptation, Silicon RF interposer technologies |
| IAF | D-Band GaN-on-SiC MMIC chiplets Sub-THz InGaAs HEMT-on-Si MMIC chiplets |
| ISIT | „Low cost“ glass interposer with Al vias, |
| IPMS | FDSOI D-Band Transceiver |
| IZM | Multi MMIC chiplet embedding using Fan-out Wafer Level Packaging (FOWLP) with backside cooling |
| FHR | BiCMOS D-Band TX |
| EMFT | Design of a D-Band Radarmodule (Receiver) in BiCMOS on Flex Polymer and RF Glass Interposer and ADC in FDSOI Technology |
Impact
The RF demonstrators within APECS will demonstrate the benefits of combining different semiconductor technologies in order to achieve improved RF performance. Chiplets fabricated in III-V and Si-based processes will be integrated on quasi-monolithic integration technologies or suitable carrier substrates. This is made possible by using innovative integration technologies such as flex-lines and wideband microbump interconnects. These platforms allow potential customers to realize innovative solutions for mm-wave and sub-THz modules. The necessary process steps are demonstrated and validated within the APECS pilot line, and the necessary STCO design flows, design enablement and the necessary methodology and equipment for testing and validation are available. This gives customers low-barrier access to the implementation of innovative ideas in the field of integrated systems in mobile communications, wireless links, radar and much more.