Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems
Photonics Chiplet
Target
In this demonstrator an O-Band 4 x 200 G Transmitter with high shore line density for I/O in HPC will be realized. The transmitter comprises a narrow pitch 4 x 200 G InP-based EML array chiplet (HHI) hybridly integrated with corresponding InP-based EML driver chiplets (FBH) on an optical interposer (IZM). This interposer serves for an efficient heat dissipation, carries the electrical feeding lines and the electrical connectors. The fiber coupling of the EML array chiplet will be realized using photonic wirebonds.
Innovation
Hybrid integrated full functional ultra high speed transmitter subassembly inclusive fiber coupling.
Partners
HHI is leading the Photonics ChipLet development. Furthermore, the responsibility for the InP-EML-Arrays and the RF-Flexlines lies with the HHI. FBH will develop the InP-EML-Driver, and IZM will realize the hybrid integration on interposer.
Impact
The demonstrator combines HHI’s expertise regarding InP-based high speed transmitters, FBH’s expertise regarding InP-based drivers and IZM’s expertise regarding interposers and hybrid integration. For the hybrid integration metallization schemes and electrical interfaces between transmitter, driver and interposer will be made compatible. The demonstrator proves that the established Pilotline involving these three different institutes allows to realize complex high speed photonic subassemblies so that these capabilities then can be offered to external customers.