On-site / May 21, 2026
PIXEurope Connect – Industry Ecosystem Building Day
Organized within the framework of the PIXEurope Pilot Line – coordinated by ICFO and co-funded by the Chips Joint Undertaking and participating Member States, with support from regional authorities – this event will be the first to bring together end-users, technology providers, industry leaders and policymakers around this Pan-European initiative.
Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems