On-site / June 09, 2026 - June 11, 2026
IMAPS Nordic Microelectronics Packaging Conference and Exhibition, NordPac
The event brings together both academics, as well as industry leaders, to discuss and debate state-of-the-art and future trends in microelectronics, packaging, integration, reliability testing, PCB design, assembly and manufacturing of electronics, optics, electronics in health tech, materials, Artificial Intelligence (AI), and Internet of Things (IoT) in electronics. This is the 62nd event organised by IMAPS Nordic chapter.
Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems