APECS – European pilot line for advanced packaging and heterogeneous integration
3rd Roadshow: Norway
Event details
Program
The Sensor Decade 2026 brings together leading voices from academia, industry and policy to explore the future of sensing technologies and their role in addressing global challenges across climate, health, industry and digital transformation.
As part of the program, APECS will contribute with a dedicated session:
APECS Session
4 June 2026 | 14:00-15:00
The pilot line for Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems (APECS), a key initiative under the EU Chips Act, is driving innovation in chiplet technologies and strengthening Europes semiconductor ecosystem.
This session will present APECS activities and expertise in the integration of advanced electronic systems, with a focus on enabling technologies for next-generation sensing applications. Covering the full process chainfrom chiplet components to fully integrated systemsparticipants will gain insights into:
- advanced packaging approaches
- heterogeneous integration technologies
- high-density interconnects and substrates
- system integration for sensor and AI-driven applications
The session will highlight how APECS supports faster innovation cycles and facilitates access to cutting-edge infrastructure for industry, research and emerging players across Europe.
Contact
Location
Oslo Science City
Gaustadalleen 21
0349 Oslo
Norway
Hosted by CC NorChip
Date
June 04, 2026